AUSTIN, Texas — Austin-based Texas Institute for Electronics (TIE) announced its executive board of directors, which will provide strategic guidance to the consortium as a national leader in semiconductor research, manufacturing infrastructure, and workforce development. The board’s members bring a breadth of talent and experience across industry, academia and government, including advanced semiconductor heterogeneous integration, AI hardware, manufacturing innovation, startups, and the defense and intelligence sectors of the U.S. semiconductor industry.
“Each member of our executive board brings decades of complementary experience in fields that are central to the future of semiconductor research, innovation and manufacturing, and key sectors including defense that rely on advancements in semiconductor technology for our most critical national interests,” said John Schreck, CEO of TIE. “Our board’s guidance and commitment will ensure Texas Institute for Electronics will continue to be a leader in advanced packaging, disruptive heterogeneous integration, and developing the skilled workforce necessary to scale to meet national demand.”
In their advisory role, the board members will inform TIE’s direction related to technology, workforce development, business strategy and finance. Specific areas of focus will include TIE’s direction related to defense, the startup ecosystem, AI hardware and other emerging technologies. The board will also advise on strategic workforce expansion to compete for federal funding and strategies to remain financially competitive.
Meghali Chopra represents the startup community as CEO of SandBox Semiconductor, which specializes in AI-enabled optimization of semiconductor manufacturing. Ken Joyce, executive adviser to Brewer Science Inc., brings CEO and manufacturing experience (Amkor Technology) and serves on the Industrial Advisory Committee for the CHIPS program. Retired Air Force Maj. Gen. Jeannie Leavitt brings three decades of defense and national security experience, as well as extensive leadership experience. Babak Sabi, a senior vice president at Intel Corp., ran Intel’s packaging, assembly and test process technology development. Sharon L. Wood represents the academic community as UT’s provost and former dean of the Cockrell School of Engineering.
The institute’s leadership also serves on its executive board. John Schreck, CEO of TIE, has more than 40 years of experience at Texas Instruments and Micron Technology, including experience with product development requiring advanced packaging. S.V. Sreenivasan, founder and chief technology officer of TIE, has 30 years of academic and industry experience, with specialization in semiconductor equipment and process technologies, as well as successfully launching semiconductor-related startups.
Complete biographical information of board members is available at txie.org/about/.
Texas Institute for Electronics is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent semiconductor and defense electronics companies, national labs and nationally recognized academic institutions. Its aim is to create a nationally recognized center for excellence in 3D heterogeneous integrated (HI) technology, pilot fabrication facilities and semiconductor workforce development.
TIE’s strategic member companies include leading semiconductor manufacturers such as Advanced Micro Devices Inc., Applied Materials Inc., Intel Corp. and Micron Technology Inc. Since 2022, the State of Texas has generously invested $552 million in TIE to develop state-of-the-art fabrication facilities.
